- Development Background and Announcement
● At ISSCC 2025, Jae-hyuk Song, President and Head of Semiconductor R&D, Samsung DS Division, announced that "the first mobile product featuring LPW DRAM optimized for on-device AI will be launched in 2028."
● LPW DRAM is garnering attention as a high-performance, low-power solution that differentiates itself from the existing low-power memory, LPDDR5X.
- Technical Features of LPW DRAM
■ 2.1 Improved Speed and Processing Performance
- LPW DRAM is expected to improve I/O speed by 166% compared to LPDDR5X, enabling data transfer exceeding 200 gigabytes (GB) per second.
- This speed improvement is suitable for mobile devices where AI computation and high-speed data processing are essential.
■ 2.2 Power Consumption Reduction
- Power consumption is expected to decrease by 54%, consuming only 1.9 picojoules (pJ) per bit.
- Low power consumption maximizes battery efficiency, making it advantageous for power-sensitive devices such as wearables.
■ 2.3 Innovative Packaging Technology – Vertical Wire Bonding (VWB)
- By applying vertical wire bonding technology, which converts the conventional curved electrical signal path to a straight line, the number of I/O terminals is increased, achieving both performance and power efficiency.
- Target Applications and Potential Uses
● Smartphones
- It is likely to be adopted in next-generation smartphones requiring high-performance AI computation and fast data processing, with enhanced AI capabilities compared to existing mobile devices.
● Wearables and other On-Device AI Devices
- Due to its drastically reduced power consumption, it is suitable for power-efficient devices such as smartwatches and is expected to be used in various devices with high AI computational demands.
- Future Outlook and Implications
● Samsung's LPW DRAM development signifies a significant advancement in mobile memory technology.
- With its remarkable improvements in performance and power efficiency compared to LPDDR5X, it is expected to significantly enhance the data processing and AI computation capabilities of next-generation mobile devices.
● The adoption of innovative packaging technology and new memory solutions
- will enhance competitiveness in the global mobile and wearable markets, becoming an essential element for future devices requiring power efficiency and fast computation.
● Ultimately, this technological advancement is expected to positively impact not only on-device AI but also the overall mobile ecosystem.
Keywords: Samsung, LPW DRAM, Mobile HBM, On-device AI, LPDDR5X, High-performance memory, Power consumption reduction, Vertical wire bonding
Samsung Electronics' innovative technological development promises to bring us closer to experiencing the next-generation mobile AI era. This is a noteworthy development deserving continued attention.
*Source URL:
https://m.sedaily.com/NewsView/2GP0NJ6DA1#cb
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