*Source: https://m.ddaily.co.kr/page/view/2025111510122557548
● Apple’s Game-Changing Foldable iPhone Unveiled
Apple ‘iPhone Fold’ Key Summary: Design, Components, Release Scenarios, Supply Chain, and Semiconductor Impact at a Glance
Key Points Covered in the Text Below:
- Summary of product design and specifications including display, thickness, camera, and biometric authentication.
- Impact on related companies and key component supply chains (display, hinge, chipset, modem, DDI).
- Release scenarios (2026 vs. 2027) along with production volume and price forecasts.
- Analysis of economic ripple effects on the market, semiconductors, and supply chains.
- Provides four ‘real factors’ often overlooked by other media and investment/strategic implications.
News Format Summary (Key Facts)
Multiple internal and external sources confirm that Apple has nearly finalized the framework for improving the completeness of the ‘iPhone Fold.’
The design features a ‘book-type’ structure akin to two thin iPhone Airs bound together, with an external cover display of approximately 5.5 inches and an internal main screen measuring 7.6-7.8 inches.
There is some confusion regarding the thickness when folded, but industry estimates suggest about 9.95mm, with the unfolded panels each approximately 4.5mm to achieve a thin feel.
It appears Samsung Display will exclusively supply the displays, designed with an in-cell structure to reduce wrinkles.
For the hinge, a high-strength ‘Liquidmetal’ alloy is considered, with Foxconn and SZS being potential mass production partners.
The A20 Pro from TSMC’s 2nm process and the second-generation self-developed modem C2 are likely to be integrated.
The display driving chip (DDI) may be miniaturized from 28nm to 16nm to improve real-use time.
The camera setup is expected to include a rear dual (48MP main + ultra-wide), an under-display camera (UDC) for the internal screen, and an external punch-hole camera.
Biometric authentication is likely to adopt Touch ID on the side button, possibly complementing or hybridizing with Face ID.
Prices are expected to range between $2,000 to $2,500, and the first-year production is estimated at around 3 to 5 million units.
There are both 2026 production scenarios and speculations about delays to 2027 due to hinge and durability issues.
Group-Specific Detailed Analysis
1) Product/Specification Group
Design
Internally at Apple, they aim to bring the ‘iPhone Air essence’ directly into the foldable.
The book-type structure targets both portability and a tablet-level display simultaneously.
Screen and Wrinkle Issues
Apple focuses on minimizing wrinkles by adopting Samsung Display’s in-cell panels.
Wrinkle correction design is a critical variable that directly influences the final release schedule.
Thickness and Battery
Although official figures remain uncertain, industry estimates suggest approximately 9.9mm when folded, with each panel about 4.5mm when unfolded.
There are rumors of a stacked 5000mAh battery, but trade-offs with ultra-thin design may lead to adjustments in final capacity.
Camera and Biometric Authentication
Expected to feature a rear dual setup (48MP + ultra-wide), with UDC internally and a punch-hole externally.
Fingerprint recognition is likely to adopt Touch ID on the side button, potentially in a hybrid setup with Face ID.
2) Component/Supply Chain Group
Display
Samsung Display is effectively confirmed as the exclusive supplier.
Samsung is expanding its production line exclusively for iPhone Fold panels and may increase investment to meet Apple’s spec demands (wrinkle minimization, in-cell method).
Hinge (Key Item)
Consideration of using Liquidmetal (twice the strength of titanium), but it is crucial to verify durability and yield rates.
Foxconn and SZS are candidates for mass production partners, but mass production might be postponed due to hinge problems.
Chipset and Semiconductor
A20 Pro (TSMC 2nm) and self-developed modem C2 are key.
There’s an expected positive demand shock for the semiconductor (foundry and chip design) industry due to increased demand for high-end fabs.
DDI miniaturization (28nm to 16nm) is a strategic point for improving battery life, offering opportunities for DDI suppliers.
Assembly and Partners
Foxconn is likely to activate its line in the latter half of 2025, with a 2026 summer production scenario, but delays to 2027 due to hinge problems are possible.
3) Market, Price, and Production Group
Price and Demand
Rumors estimate pricing to be between $2,000 and $2,500.
Despite a high-price strategy, Apple shares an internal forecast that the ‘premium foldable’ demand can boost overall iPhone shipments by more than 10%.
Production Estimate
First-year production is estimated at 3-5 million units.
Price, combined with production constraints (hinge/display yield), could lead to both initial supply shortages and a premium effect.
4) Economic, Semiconductor, and Supply Chain Impact
Semiconductors (Foundry/Chip)
If A20 Pro (2nm) orders materialize, TSMC’s 2nm order volume and cap investment could accelerate.
Demand for DDI miniaturization offers opportunities for specialized DDI companies (lead board companies).
Display/Component Industry
Samsung Display’s dedicated line investments might concentrate high added-value OLED production in Korea.
If LG Display is ruled out post-trial, there could be changes in the global panel competition structure.
Supply Chain Risk (Geopolitical/Manufacturing Focus)
Apple’s reliance on key components from Samsung and specific assemblers (Foxconn, etc.) increases supply chain focus, escalating the risk of geopolitical and supply disruptions.
Issues with hinge, DDI, or module yield could have ripple effects on global smartphone market prices, stock, and supply.
The Most Important Content Often Overlooked by Other Media (Exclusive Perspective)
1) DDI miniaturization dictates the entire product ecosystem’s cost and performance.
- It directly affects not only display quality but also battery life, heating, and cost structure.
- Moving DDI to 16nm significantly impacts the profitability (demand increase, facility investment repositioning) of component suppliers and foundries.
2) Hinge ‘yield’ is the practical determinant for shipment volume and potential launch delays.
- Even with Liquidmetal, issues remain with repetitive durability, surface finishing, and coating in mass production.
- A delay from 2026 to 2027 due to hinge problems increases the risk of competitors (Samsung, Google, Chinese firms) seizing foldable market share.
3) Apple’s ‘exclusive procurement’ decision on panels accelerates the restructuring of the global panel market.
- Should the scenario of exclusively routing orders through Samsung manifest, Samsung would gain pricing and production leadership in premium foldable panels.
- It’s a short-term boon for the Korean supply chain (equipment/materials) but a blow to global competitors (China, Taiwan).
4) Although high-priced, if the ‘iPhone Fold effect’ can increase overall iPhone shipments by more than 10%, as internal forecasts suggest, demand for components and semiconductors may expand faster than expected.
- Especially the demand for the A20 Pro (2nm) and C2 modem increases pressure on 2nm foundry capex and equipment investment.
Investment and Business Strategic Implications
Companies related to Samsung Display, DDI, foundries, and camera modules are likely to benefit in the short term.
Small to medium-sized enterprises with hinge and precise mechanical solutions need to rapidly secure quality and yield verification capabilities in Apple’s supply bidding rounds.
Semiconductor equipment and material companies should reassess equipment supply and service positioning in anticipation of 2nm transition demand.
From an investment perspective, it’s important to monitor stocks and suppliers related to the A20 Pro, C2 supply chains (foundries, packaging), and Samsung Display.
Conclusion — One Sentence Key Point
The iPhone Fold’s design and critical component choices (Samsung in-cell, Liquidmetal hinge, TSMC 2nm AP) could become a catalyst for restructuring in the future smartphone, semiconductor, and display supply chains.
< Summary >
- iPhone Fold: Book type with a 7.6-7.8-inch internal and 5.5-inch external display, aiming for a thin profile.
- Key Partners: Samsung Display (panel), Foxconn and SZS (assembly), TSMC (2nm AP).
- Technical Variables: In-cell panel, Liquidmetal hinge, DDI 28→16nm, UDC.
- Price/Production: $2,000-$2,500, 3-5 million initial production, uncertain release in 2026-2027.
- Economic Impact: Expansion in semiconductor (2nm) and display investment, rising supply chain concentration and geopolitical risk.
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